Grooves formed around a semiconductor device on a circuit board



FIG. 1 shows a plan view of the grooves formed around a semiconductor device on a circuit board showing the design according to the invention.

FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2; and,

FIG. 4 shows an enlarged sectional view along the line 4—4 in FIG. 2.

The elements shown in broken lines and dash-dot-dash lines are for illustrative purposes only and form no part of the claimed invention. 

The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described. 